EF No-Clean Soldering Paste Tin Mud Phone Repair Tool SMT Patch Maintenance LED

1,546.50

50 in stock

SKU: k2935905936 Category:

Description

1.A high viscosity no-clean flux widely used for BGA PGA reworkingsoldering and reballing of computer and phone chips . 2.The mixture of high-quality alloyed powder and resinic pasty flux can avoid the pale yellow residue easy to clean the board. 3.Joint high intensitygood immersion. 4.Unique recipes perfect performance easy to weld solder bright and full no weld false welding and so on. 5.Good insulationsmooth welding surfacegood soldering and welding tool. Model:XD-50 Bottle Color:Blue Item size: 27 x 27mm

Additional information

Weight 1 kg

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